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Reliability Technology for Integrated Circuit Packaging

By (author) Bin Zhou, By (author) Yunfei En, By (author) Si Chen

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This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress. Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of ""high-quality development"" a focus on reliability is essential to advancing manufacturing. Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

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The Order of Time

Carlo Rovelli
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224 pages
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Originally published in Italian: L'ordine del tempo (Milan: Adelphi Edizioni, 2017).

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The Coming Wave: AI, Power and Our Future

Mustafa Suleyman
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352 pages
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Helgoland: The Strange and Beautiful Story of Quantum Physics

Carlo Rovelli
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