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Modeling and Application of Flexible Electronics Packaging

By (author) YongAn Huang, By (author) Zhouping Yin, By (author) Xiaodong Wan

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normal price: R 4 322.95

Price: R 3 890.95

| book description |

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

| product details |



Normally shipped | Available from overseas. Usually dispatched in 14 days
Publisher | Springer Verlag, Singapore
Published date | 7 May 2019
Language |
Format | Hardback
Pages | 287
Dimensions | 235 x 155 x 0mm (L x W x H)
Weight | 0g
ISBN | 978-9-8113-3626-3
Readership Age |
BISAC | technology / electronics / general

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