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books
| book details |
Die-stacking Architecture
By (author) Yuan Xie, By (author) Jishen Zhao
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| on special |
normal price: R 1 309.95
Price: R 1 243.95
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| book description |
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the ""memory wall"" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
| product details |
Normally shipped |
Publisher | Springer International Publishing AG
Published date | 10 Jun 2015
Language |
Format | Paperback / softback
Pages | 113
Dimensions | 235 x 191 x 0mm (L x W x H)
Weight | 0g
ISBN | 978-3-0310-0619-7
Readership Age |
BISAC | technology / electronics / circuits / general
| other options |
Normally shipped |
Readership Age |
Normal Price | R 1 713.95
Price | R 1 628.95
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An epic love story with the pulse of a thriller that asks: what would you risk for a second chance at first love?
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Matt Dinniman
Paperback / softback
480 pages
was: R 507.95
now: R 446.95
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