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books
| book details |
Thin Films: Volume 795: Stresses and Mechanical Properties X
Edited by Sean G. Corcoran, Edited by Young-Chang Joo, Edited by Neville R. Moody, Edited by Zhigang Suo
| book description |
Understanding the mechanical behavior of thin films is crucial for a wide variety of technologies. This behavior can critically influence the design, performance and reliability of thin-film structures used in every area of thin-film technology. However, the performance of these devices is often limited by the mechanical properties of both the films and the structures to which they are attached. The concepts, models and techniques developed for bulk materials often do not apply to small dimensions, and the mechanisms controlling behavior are not well defined. This book, first published in 2004, brings together an international group of researchers and students from industry, academia and national laboratories to address the mechanical behavior of thin films. Of particular interest are those studies that cut across length scales such as atomistic-to-nanometer or nanometer-to-submicron scale. Topics include: stress evolution; modeling stresses and film instability; deformation and adhesion; film fracture and fatigue; processing and structure; indentation testing; mechanical properties; properties and performance; and multilayers and nanolaminates.
| product details |
Normally shipped |
Publisher | Materials Research Society
Published date | 22 Mar 2004
Language |
Format | Hardback
Pages | 608
Dimensions | 228 x 152 x 33mm (L x W x H)
Weight | 980g
ISBN | 978-1-5589-9733-2
Readership Age |
BISAC | technology / material science
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