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Through Silicon Vias: Materials, Models, Design, and Performance

By (author) Brajesh Kumar Kaushik, By (author) Vobulapuram Ramesh Kumar, By (author) Manoj Kumar Majumder, By (author) Arsalan Alam

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normal price: R 2 305.95

Price: R 2 075.95

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Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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Normally shipped | Available from overseas. Usually dispatched in 14 days
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Normal Price | R 2 741.95
Price | R 2 467.95 | on special |

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The Coming Wave: AI, Power and Our Future

Mustafa Suleyman
Paperback / softback
352 pages
was: R 295.95
now: R 265.95
Stock is usually dispatched in 6-12 days from date of order

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The Memory Collectors: A Novel

Dete Meserve
Paperback / softback
320 pages

Enquiries only

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The Colonialist: The Vision of Cecil Rhodes

William Kelleher Storey
Paperback / softback
528 pages
was: R 425.95
now: R 382.95
Usually dispatched in 6-12 days

This first comprehensive biography of Cecil Rhodes in a generation illuminates Rhodesâ€™s vision for the expansion of imperialism in southern Africa, connecting politics and industry to internal development, and examines how this fueled a lasting, white-dominated colonial society.

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Survive the AI Apocalypse: A guide for solutionists

Bronwen Williams
Paperback / softback
232 pages
was: R 340.95
now: R 306.95
Forthcoming

Let's stare the future down and, instead of fearing AI, become solutionists.

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