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Design And Modeling For 3d Ics And Interposers

By (author) Madhavan Swaminathan, By (author) Ki Jin Han

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normal price: R 6,044.95

Price: R 5,439.95

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3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.

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The Silent Patient: The record-breaking, multimillion copy Sunday Times bestselling thriller and TikTok sensation

Alex Michaelides
Paperback / softback
352 pages
was: R 254.95
now: R 229.95
Usually dispatched in 4-8 weeks

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Free Your Mind: The new world of manipulation and how to resist it

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Paperback / softback
384 pages
was: R 273.95
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The Thing at 52

Mr. Ross Montgomery
Hardback
40 pages
was: R 382.95
now: R 343.95
Usually dispatched in 3 to 4 weeks as supplier is out of stock

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